The Eindhoven University of Technology (TU/e) harbors a unique combination of research groups covering the entire chain from cutting-edge fundamental and applied materials-related nanoscience to device and system engineering. These research groups combine their efforts on photonics within the Institute for Photonic Integration (IPI; www.tue.nl/ipi). This enables them to develop and investigate new generations of photonic materials and devices, components and circuits and systems. IPI’s ultimate mission is to break through current technological and theoretical limits along the entire value chain and help solve some of society’s most pressing challenges regarding the future of internet, energy, healthcare, mobility and security.
One of the research groups within IPI is the Photonic Integration group (PhI; www.tue.nl/phi). PhI performs leading edge research into indium phosphide semiconductor based technology for photonic integration and its applications. This develops along three research lines and involves a number of national and international research projects. The research lines are monolithic integration of indium phosphide (InP) photonic devices, heterogeneous and hybrid integration platforms, and nanophotonic integration. The technology platforms developed by PhI researchers become available on an open access basis via JePPIX (the Joint European Platform for Photonic Integration of Components and Circuits; www.jeppix.eu).
JePPIX was initiated in 2006 as a technology platform for providing open access to InP-based photonic integration processes. The platform provides open access to advanced photonic integration processes using a foundry model, and its service is globally unique: no other organization provides open access to InP-based foundry processes. JePPIX aims at low-cost development of application specific PICs using the generic foundry model, and rapid prototyping via industrial multi-project wafer runs. JePPIX closely collaborates with Europe’s key players in the field of photonic integration, including manufacturing and packaging partners, photonic CAD software partners, R&D labs and photonic ICs design houses.